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EE Times
U.S. e-passport plan raises tech, diplomatic hackles
July 16, 2004
By Junko Yoshida
PARIS — The U.S. Department of Homeland Security
will host a testing event for electronic passports
featuring biometric data next week, opening a can of
technological worms that will tax the ingenuity,
patience and diplomacy of dozens of national
governments, chip vendors and reader manufacturers.
Foremost among the questions raised by the three-day
meeting in West Virginia is whether the world is ready
to meet even the extended deadline — a little more
than one year from now — that the U.S. government has
set for 27 visa-waiver countries to issue biometrically
enabled, machine-readable passports if their citizens
are to visit the United States.
Acknowledging that two past deadlines were
unrealistic, the U.S. House of Representatives last
month voted to grant visa-waiver countries — which
include most of Europe, Japan, Singapore, Australia and
New Zealand — until Oct. 26, 2005, to deploy
biometrically enabled passports. The bill has yet to be
debated in the Senate. Because of the difficulty of
marshaling the appropriate technology, the Bush
administration favors a deadline of November 2006.
"Rushing a solution to meet the current deadline
virtually guarantees that we will have systems that are
not interoperable," said Secretary of State Colin
Powell in urging Congress to delay the legislative
deadline by two years. Testifying before the House
Judiciary Committee in April, Powell added, "Such a
result may undercut international acceptance of this new
technology as well as compound rather than ease our
overall challenge."
Indeed, implementing biometrics technologies on a
global scale "is a huge task," said Joseph
Kim, senior consultant at International Biometric Group,
an independent consulting firm based in New York.
Congress, he added, passed the legislation based on
"a misconception of how standardized the technology
is."
The biometric industry aggravated the problem by
overpromising its technology amid the national post-9/11
angst. That contributed to unwarranted optimism among
U.S. policymakers about the availability of bug-free
electronic passports. Vendors eager to win contracts
insist on the readiness of their wares, but the
biometric products in question have undergone no
field-testing. "Without gaining real experience and
getting more data, we won't know how far we are and how
good we are," said Andreas Raeschmeier, general
manager of the financial and ID division of
STMicroelectronics.
In addition, the unilateral U.S. mandate has ruffled
feathers among U.S. allies. Because 20 of the 27
countries in the Visa Waiver Program are in Europe, the
European Commission is expected by year's end to develop
new specifications for European passports that will,
like those issued by the United States, adhere to
standards set by the International Civil Aviation
Organization (ICAO).
However, Europe is determined not to be railroaded by
Washington in the areas of data protection and privacy,
said industry sources and policymakers here, who spoke
on the condition of anonymity. "Europe cannot stop
the [U.S.] train, but at least we want to be able to
decide what to put in the train," said Detlef
Houdeau, senior director of the Secure Mobile Solutions
business group at Infineon Technologies AG in Germany.
Some technical elements for biometric passports are
in place. ICAO last year defined such basic frameworks
as what biometric technology is to be incorporated in
next-generation travel documents. It specified the
inclusion of face images, plus mandatory biometric data
of some sort (fingerprints and iris recognition are
optional). Two months ago, ICAO issued more detailed
technical specifications defining data structures,
command sets and communication between a passport and a
reader terminal, all necessary for biometrics data
stored in E2PROM inside a contactless chip to be read by
a reader.
Infineon's Houdeau said 95 percent of ICAO specs on
the table today are "frozen." In parallel, the
International Organization for Standardization is
working on a certification program for the technology.
But industry and government agencies have barely
begun tackling issues related to implementing the
technology. No one knows how accurately the ICAO specs
will be implemented on chips, readers and passports. The
pretest to be held July 27-29 in West Virginia will be
the maiden voyage for most of the crucial components. A
field trial involving thousands of real people carrying
electronic passports won't happen until next year.
The industry hasn't yet had a chance to optimize
these products. Companies have yet to develop benchmarks
to gauge the speed, performance and acceptance ratio of
the biometrics technology.
Budesdruckerei, originally Germany's state-owned
security printing house and now a supplier of security
documents such as ID cards, passports and banknotes,
reported that it is using Philips Semiconductors'
contactless chip with 32 kbytes of memory in its
prototype passports. But the 64-kbyte chips the company
wants — for storing a facial image (20 kbytes) plus
two index fingerprints (10 kbytes each) — are
unavailable in volume. Infineon recently announced a
contactless chip with 64 kbytes of storage space, plus a
cryptographic engine said to comply with ICAO specs.
Infineon is eager to submit the chip for testing in
trials, but "We only have a couple of
samples," said Hartmut Hemme, sales manager for
Bundesdruckerei. Aside from chips is the issue of
packaging. In general, the interoperability of passports
"is feasible," thanks to the ICAO standards,
said ST's Raeschmeier. "But my key concern is on
the reliability of passports." Raeschmeier said he
is worried about how well the packaging and antenna
embedded in a passport can withstand the mechanical
stress of being handled, stamped, read, reread and
crushed over the standard 10-year life cycle.
"The challenge is how much thinner we can make
the package while ensuring its stability," said
Michael Ganzera, marketing manager, e-government and
smart identity, at Philips Semiconductors. Philips will
roll out in the third quarter a controller chip in a new
package just 320 microns high, against the previous
390-m standard. The thinner package is designed to be
integrated in a polycarbonate holder page. A feasibility
study on the reliability of thinner packaging is
ongoing.
Nor has a decision been made on the security of a
communication link between a chip and a reader. ICAO
gives a range of options, but it's up to each country to
determine how tight to screw this down in its own
passports. The choice of an operating system for a
passport chip is also each country's individual choice.
An even bigger issue is the handling of biometric
data. ICAO "says nothing about the backbone
system," said Infineon's Houdeau. Developing rules
and regulations on "what to do with the
[biometrics] data" once it's collected and stored
on a chip is up to each government. The EC is now
debating access control — whether to allow unlimited
access, or to specify restrictions — to the biometric
data stored on a passport chip. One proposal is that the
biometric data cannot be unlocked, or made available for
reading, unless an optical-character number used in the
passport is first read by an optical-machine reader.
This extra layer of data protection would prevent
biometric data from being "skimmed" without
the knowledge of the passport holder, according to
Bundesdruckerei's Hemme.
Beyond access control, some European countries are
reportedly considering the use of a crypto coprocessor
that permits the calculation of elliptical curves in
passports, so that the raw biometric data inside the
chip can be encrypted. The United States, in contrast,
is opting for a much lower level of security for data
communication, said Infineon's Houdeau.
"Europe is taking a measured approach,"
said Sadhbh McCarthy, managing director at the European
Biometrics Forum. Based in Dublin, Ireland, and
initially funded by the EC and the Irish government, the
EBF is a network of experts and organizations charged
with establishing a realistic vision of the future of
the biometrics industry in Europe. "The data
protection and privacy will be foremost in the minds of
the member states and the European Commission," she
said.
Almost every key player will be participating in the
West Virginia tests. They will explore such basic issues
as detecting whether chips are within reading range; the
type of a contactless chip involved (whether using ISO/IEC
14443 Type A or Type B, which differ in the data
transmission protocols used); and whether the chip uses
basic access control; how many chips are in range.
The U.S. Government Printing Office last week issued
the final request for proposals for electronic U.S.
passports, with an Aug. 12 response deadline. The
government plans to create "vehicles" for
testing terminals and passports. Prototypes must be
submitted by the end of the year.
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